HPE ProLiant DL325 Gen12 Processors

Genuine 5th Gen AMD EPYC processor kits for the HPE ProLiant DL325 Gen12, new and refurbished. The server takes one EPYC 9005 series processor in a 6096-pin LGA SP5 socket, and because there is only one, its choice fixes everything downstream: core count, 128 lanes of PCIe 5.0, the 6TB memory ceiling and, through its wattage, which heat sink and fan kit the chassis needs.

DL325 Gen12 Processor Specifications

• Socket: one 6096-pin LGA SP5, System on Chip design with no separate chipset
• Family listed: 23 5th Gen AMD EPYC 9005 kits, from the EPYC 9015 (8 cores, 3.6GHz base, 4.1GHz max, 125W, 64MB L3) to the EPYC 9965 (192 cores, 2.25GHz base, 3.7GHz max, 500W, 384MB L3)
• Largest cache: 512MB L3 on the 128-core EPYC 9755 and the 16-core EPYC 9175F
• Highest clocks: 5GHz maximum on the EPYC 9175F and 9575F; the F-suffix parts carry the highest base frequencies in the table, up to 4.2GHz on the 9175F
• I/O and memory: 128 PCIe 5.0 lanes and 12 DDR5 channels per processor, every listed part rated for 6400 MT/s DIMMs and up to 6TB at two DIMMs per channel
• Wattage: the figure in each kit name is the processor's default configurable TDP, from 125W to 500W
• Cooling by wattage: standard heat sink and fan to 240W, performance heat sink and fan at 260-300W, closed-loop liquid-cooling heat sink and fan at 320W and above; an air baffle kit is required with the standard and performance heat sinks

300W is the line between air and liquid on this server. HPE's cooling matrix pairs processors up to 240W with the standard heat sink and fan, 260-300W with the performance heat sink and fan, and 320W and above with the closed-loop liquid-cooling heat sink and fan. Order the heat sink and fan kit that match the processor's wattage, and add the air baffle kit with either air-cooled heat sink.

Which EPYC 9005 for a DL325 Gen12?

The 300W line is the one that matters for a field upgrade. Up to 300W the server stays on air, with either the standard or the performance heat sink; from 320W it needs the closed-loop liquid-cooling heat sink, which contains a cold plate, pump, tubes and radiator, adds iLO 7 leak detection, and is a part HPE recommends replacing every five years. On the GPU chassis the closed-loop heat sink cannot be selected at all and a processor above 300W requires the factory direct-liquid-cooling option, so a GPU server is in practice a 300W-and-below server as a field build.

Choosing the Right DL325 Gen12 Processor

• Buy the heat sink with the processor. HPE's air-cooling matrix ties the heat sink and fan kit to processor wattage, and a heavier processor in a lighter chassis is an unsupported configuration, not a slower one.
• Remember the air baffle. The standard and performance heat sinks both require the air baffle kit; the closed-loop liquid-cooling heat sink requires the liquid-cooling fan kit instead.
• Cores and clocks pull against each other. The 192-core 9965 runs a 2.25GHz base; the 16-core 9175F runs 4.2GHz base and 5GHz max with the same 512MB L3 as the 128-core 9755. Pick for the workload, not the headline core count.
• Check the ambient limit. HPE's air-cooling thermal matrix drops several 300W-plus and F-series parts to 25°C or lower inlet temperature in some chassis, lists the 9275F, 9475F and 9755 as N/A on the GPU chassis, and states that processors above 300W require a direct liquid cooling kit there.
• The processor is also the memory decision. All 23 kits support 6TB and 6400 MT/s DIMMs, but 96GB, 128GB and 256GB DIMMs on a processor of 240W or below force the performance fan kit.

Complete Your DL325 Gen12 Build

Processor choice sets the memory and cooling — see DL325 Gen12 memory and power supplies alongside this page, and the DL325 Gen12 parts listing for the fan kits and air baffle. Also available: DL325 Gen12 drives, storage controllers and networking adapters. The adjacent generation is DL325 Gen11 processors, the rest of the range sits under HPE ProLiant DL rack server parts, and every model we stock is indexed under HPE parts by server model.

DL325 Gen12 Processors FAQ

Which processors does the DL325 Gen12 support?
5th Gen AMD EPYC 9005 series, one per server in an SP5 socket. HPE lists 23 kits, from the 8-core EPYC 9015 at 125W to the 192-core EPYC 9965 at 500W, including the P-suffix 9655P, 9555P, 9455P and 9355P and the F-suffix 9575F, 9475F, 9375F, 9275F and 9175F.

Can I put two processors in a DL325 Gen12?
No. The DL325 Gen12 is a single-socket server: one 5th Gen AMD EPYC 9005 processor in one 6096-pin LGA SP5 socket, one heat sink kit, and all 24 DIMM slots and 128 PCIe 5.0 lanes served by that processor.

Which heat sink does my DL325 Gen12 processor need?
It follows the wattage. HPE's matrix gives the standard heat sink and standard fan up to 240W, the performance heat sink and fan at 260-300W, and the closed-loop liquid-cooling heat sink and fan at 320W and above. The standard and performance heat sinks also require the air baffle kit.

What does the closed-loop liquid cooling heat sink involve?
It is a self-contained module with a cold plate, pump, tubes and radiator, cooled by inlet air, with leak detection through iLO 7 that shuts the server down if a leak is detected. HPE states it is field upgradable but that the coolant cannot be replaced, and recommends replacing the module every five years. It cannot be selected on the GPU chassis.

Does the processor limit DL325 Gen12 memory?
Only in speed. Every listed EPYC 9005 supports 6TB and is rated for 6400 MT/s DIMMs; the platform runs 5200 MT/s at one DIMM per channel and 4000 MT/s at two according to HPE's speed table. Large DIMMs on a processor of 240W or below do require the performance fan kit.

What is the highest-clocked processor for the DL325 Gen12?
The EPYC 9175F, with a 4.2GHz base and 5GHz maximum on 16 cores and 512MB of L3 at 320W, and the 64-core EPYC 9575F, which also reaches 5GHz maximum from a 3.3GHz base at 400W. Both need the closed-loop liquid-cooling heat sink.

✅ Looking for a specific DL325 Gen12 processor? Browse our full selection below.

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